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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

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1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable

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Brand Name : AOK

Model Number : TP300

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 400mmx200mm

Product name : 1.5mm Thickness 3.0W Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive

Composition : Ceramic Filler + Silicone

Thickness : 0.5~10.0(mm)

Density : 3.0 (g/cc)

Hardness : 40 (Shore OO)

Usage Temperature : -40~150(℃)

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1.5mm Thickness 3.0W Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive

TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Industrial: LEDs, Power Supplies and Conversion

TP300 Thermal conductive pad has good compressibility, insulation, especially suitable for the use of transfer heat crack, can fill the gap, between the cooling parts and heating parts can have good heat transfer, and also can have shock absorption, and sealing effect, can reach the design requirements of equipment miniaturization and ultra-thin, is extremely practical and manufacturability of a product.

Thermal Conductivity :3.0W/m.K
Standard size:200mm×400mm,Thickness:0.5—10.0mm
Thermal silicon pad can be coated with adhesive, insulating cloth, copper foil, aluminum foil on one side or both sides.
can be processed into various specifications and any kinds of shapes according to customers’ demands.

TP300 is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP300 is easy handling and converting process and reusable special property.

Product feature


■ Thermal conductivity: 3.0W/mK
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment

Typical applications


■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards

Purchase information:

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Blue Visual
Thickness(mm) 0.3~10.0 ASTM d374
Density(g/cc) 3.0 ASTM D792
Hardness(shore oo) 40 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥6.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470


Product Tags:

1.5mm Heatsink Cooling Pad

      

3W Heatsink Cooling Pad

      

Heatsink Cooling Thermal Conductive Silicone Pad

      
China 1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable wholesale

1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable Images

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