Brand Name : AOK
Model Number : TP300
Certification : RoHS, Reach, UL
Place of Origin : China
MOQ : 1000pcs
Payment Terms : T/T
Delivery Time : 13-15working days
Packaging Details : 400mmx200mm
Product name : 1.5mm Thickness 3.0W Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive
Composition : Ceramic Filler + Silicone
Thickness : 0.5~10.0(mm)
Density : 3.0 (g/cc)
Hardness : 40 (Shore OO)
Usage Temperature : -40~150（℃）
TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Industrial: LEDs, Power Supplies and Conversion
TP300 Thermal conductive pad has good compressibility, insulation, especially suitable for the use of transfer heat crack, can fill the gap, between the cooling parts and heating parts can have good heat transfer, and also can have shock absorption, and sealing effect, can reach the design requirements of equipment miniaturization and ultra-thin, is extremely practical and manufacturability of a product.
Thermal Conductivity :3.0W/m.K
Thermal silicon pad can be coated with adhesive, insulating cloth, copper foil, aluminum foil on one side or both sides.
can be processed into various specifications and any kinds of shapes according to customers’ demands.
TP300 is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP300 is easy handling and converting process and reusable special property.
■ Thermal conductivity: 3.0W/mK
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||40||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||10^13||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
1.5mm Thickness Heatsink Cooling Thermal Conductive Silicone Pad 3W Durable Images