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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Pink 2.3G/CC Thermal Conductive Pad Self Adhesive Elastic For 5G

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Pink 2.3G/CC Thermal Conductive Pad Self Adhesive Elastic For 5G

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Brand Name : AOK

Model Number : TP120

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 400mmx200mm

Composition : Ceramic Filler + Silicone

Color : Pink

Thickness : 0.5~12.0(mm)

Density : 2.3 (g/cc)

Hardness : 20±5 (Shore OO)

Tensile Strength : 0.4(kn/m)

Elongation : 52%

Usage Temperature : -40~150(℃)

Breakdown Voltage : ≥6.5(kv/mm)

Dielectric Constant : 5.3(@10mhz)

Volume Resistivity : 1.0*10^12(Ω.cm)

Flammability : V-0

Thermal conductivity : 1.2±0.1(W/m.K)

Product Name : Low Oil Permeability Low Volatility Pink Silicone Thermal Conductive Pad For 5G

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Low Oil Permeability Low Volatility Pink Silicone Thermal Conductive Pad For 5G

TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.

With the rapid development of big data and 5g commercialization, 5g network will not only serve mobile phones. The characteristics of low delay make it possible for intelligent manufacturing plants, driverless, Internet of things and so on. However, the transmission capacity, transmission speed and information processing speed will be more strictly controlled than ever before.

However, 5g requires higher data transmission speed and low delay. It needs to increase the number of large-scale output and input antenna systems, high-performance processors, special integrated circuits and hardware components in the base station. High density, high heat, high integration, small size and low weight are the development direction of 5g equipment. As a result, the system design is facing more and more thermal challenges, which requires a higher level of thermal management technology capability! At present, the heat dissipation scheme of 5g base station mainly adopts the closed natural heat dissipation scheme, which transfers heat to the external environment through heat conducting interface materials. For example, TP series thermal conductive silicone pad is a thermal conductive material for communication equipment base stations, which can solve the heat dissipation problem of processors and FPGAs. It has a high thermal conductivity of 1-10W. It has the characteristics of softness, elasticity, low oil permeability and low volatility. It can provide a variety of thickness options. It is also more suitable for the compact structure of 5g base station. Its operation is simple, convenient and fast, which greatly improves the production efficiency.



Product feature:

  • Thermal Conductivity:1.2W/mK
  • Ultra soft and highly compliant
  • Naturally tacky, easing application
  • Low pressure versus deflection
  • Excellent, high volume applications
  • Good thermal conductivity

  • Low volatility, low oil permeability and high thermal conductivity;

  • With self-adhesive without additional surface adhesive;

  • High compressibility, soft and elastic, suitable for low pressure applications;

  • At -45~200 ℃, various thickness options are available.

Typical applications:

  • Networking and Telecommunications
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:






Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness (mm) 0.5~12.0 ASTM d374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20±5 ASTM D2240
Tensile Strength(kn/m) 0.4 ASTM D624
Elongation % 52 ASTM D412
Usage Temperature(℃) -40~150 -
Electrical
Breakdown Voltage(kv/mm) ≥6.5 ASTM D149
Dielectric Constant(@1mhz) 5.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^12 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 1.2±0.1 ASTM D5470


Product Tags:

Pink Thermal Conductive Pad

      

2.3g/Cc Thermal Conductive Pad

      

5G Pink Thermal Pad

      
China Pink 2.3G/CC Thermal Conductive Pad Self Adhesive Elastic For 5G wholesale

Pink 2.3G/CC Thermal Conductive Pad Self Adhesive Elastic For 5G Images

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